SPYM vs IS3N: Overlap, Cost & Holdings
State Street® SPDR® MSCI Emerging Markets UCITS ETF (SPYM) and iShares Core MSCI EM IMI UCITS ETF (Acc) (IS3N) overlap by 83.5 % — the share of capital both funds put into the same companies. 1077 names appear in both. Holding both means buying that part twice.
Overlap83.5 %
Shared holdings1077
Only in SPYM0
Only in IS3N1861
The two funds
| SPYM | IS3N | |
|---|---|---|
| Name | State Street® SPDR® MSCI Emerging Markets UCITS ETF | iShares Core MSCI EM IMI UCITS ETF (Acc) |
| ISIN | IE00B469F816 | IE00BKM4GZ66 |
| Index | MSCI Emerging Markets | MSCI EM IMI |
| Provider | SPDR | iShares |
| Ongoing charges | 0.18 % | 0.18 % |
| Fund size | 2.2 bn | – |
| Income treatment | thesaurierend | thesaurierend |
| Replication | physisch | physisch (sampling) |
| Holdings we track | 1077 | 2938 |
What both funds hold
The 15 largest shared positions, ranked by the weight both funds carry at once.
| # | Stock | SPYM | IS3N | both |
|---|---|---|---|---|
| 1 | Samsung Electronics Co. Ltd. | 7.26 % | 6.32 % | 6.32 % |
| 2 | 5.09 % | 4.43 % | 4.43 % | |
| 3 | Tencent Holdings Ltd. | 2.86 % | 2.48 % | 2.48 % |
| 4 | Alibaba Group Holding Limited | 2.15 % | 1.86 % | 1.86 % |
| 5 | 1.57 % | 1.36 % | 1.36 % | |
| 6 | 0.92 % | 0.82 % | 0.82 % | |
| 7 | Samsung Electronics Co Ltd Pfd Non-Voting | 0.88 % | 0.76 % | 0.76 % |
| 8 | Hon Hai Precision Industry Co. Ltd. | 0.82 % | 0.71 % | 0.71 % |
| 9 | China Construction Bank Corporation Class H | 0.80 % | 0.69 % | 0.69 % |
| 10 | HDFC Bank Limited | 0.69 % | 0.61 % | 0.61 % |
| 11 | 0.68 % | 0.59 % | 0.59 % | |
| 12 | ICICI Bank Limited | 0.63 % | 0.56 % | 0.56 % |
| 13 | 0.59 % | 0.52 % | 0.52 % | |
| 14 | ASE Technology Holding Co. Ltd. | 0.55 % | 0.47 % | 0.47 % |
| 15 | Samsung Electro-Mechanics Co. Ltd | 0.50 % | 0.42 % | 0.42 % |
What only one of them holds
Only in SPYM (0)
More comparisons with these funds
In the Alysly network
How SPYM connects to ETFs, indices and neighbouring names — every link is a measured relation, not a recommendation.